CP machines of pressure plates center driven type  are developed from Basic Type CP machines by adding a set of pressure plate center driven roller which drives four plate to rotate during process. This structure can eliminate the speed difference of the pressure plates caused by the different characteristics of air cylinders and the different polishing friction on each head, so as to better ensure the consistency of the polishing results of each head; At the same time, the speed of the guide wheel is adjustable, so the speed of the pressure plates can be adjusted according to the process needs, and the polishing process is more flexible.

Ceramic plate or pressure plate is positioned through the central driving roller and outer guide roller. Through the rotation of the polishing plate and the matching action of the outer guide roller, the switching of the ceramic plates among different stations can be realized. Assisted by the manipulator and control system, the automatic production line can be built to improve the efficiency and reduce the cost.

Wafer bonding(bonding) method

Three types of wafer holding methods which are: wax bonding, holding by polishing templates, using vacuum chuck , can also be applied on pressure plate center driven type CP machines.

In order to obtain stable polishing process, CP series polishing machine is recommended to use with polishing slurry management system to control the flow, temperature, pH value and other indicators of polishing fluid.

CD TYPE CP series chemical mechanical polishing machine

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